This product is a one component UV curing adhesive with excellent adhesion to PC,   glass and other substrates. It has the characteristics of high bonding strength, low volatility, low  shrinkage, low water absorption, strong adaptability and excellent environmental resistance. It  has the special functions of sealing, or conductivity, or thermal conductivity, or high  temperature resistance, or high thixotropy, or anti shielding, or anti fingerprint, anti fog and so  on. Main applications: type-C connector, camera module, fuel cell, proton membrane and other  electronic products bonding and sealing.