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QINGDAO DOCBOND NEW MATERIAL CO.,LTD  

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Company Info

QINGDAO DOCBOND NEW MATERIAL CO.,LTD [China (Mainland)]


Business Type:Manufacturer, Trading Company, Service
City: Qingdao
Province/State: Shandong
Country/Region: China (Mainland)

Electronic glue (Total 11 Products)

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  • DB|Low Temperature Curing Adhesive

DB|Low Temperature Curing Adhesive

DB291

Application:Bonding for camera module, LED backlight and low temperature process component

2023-03-08

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  • DB|Connector waterproof glue DB 740

DB|Connector waterproof glue DB 740

DB740

Application:High temperature waterproof seal

2023-03-08

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  • DB|Connector waterproof glue DB 736

DB|Connector waterproof glue DB 736

DB736

Application:High temperature waterproof seal

2023-03-08

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  • DB|High Thermal Conductivity Epoxy Adhesive

DB|High Thermal Conductivity Epoxy Adhesive

DB118

Application:Heat conduction bonding for chip to heat sink, chip to new energy vehicle water cooling

2023-03-08

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  • DB|Two component Structural Adhesive

DB|Two component Structural Adhesive

DB3030

Application:Structural bonding for automotive, marine communication equipment

2023-03-08

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  • DB|UV Cure Adhesive DB 790

DB|UV Cure Adhesive DB 790

DB790

Application:Bonding for electronics, bullet

2023-03-08

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  • DB|Conductive adhesive DB 382

DB|Conductive adhesive DB 382

DB382

Application:Conductive bonding

2023-03-08

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  • DB|UV Cure Liquid Sealant

DB|UV Cure Liquid Sealant

DB724

Application:Sealing for oil systems like oil cooling system, engine cover etc.

2023-03-08

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  • DB|Acrylic Thermally Conductive Adhesive

DB|Acrylic Thermally Conductive Adhesive

DB746H

Application:Thermal Conductive Bonding of Electronic Components

2023-03-08

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  • DB|In Mold Injection Adhesive

DB|In Mold Injection Adhesive

DB1109

Application:Injection bonding of plastic to glass and metal

2023-03-08

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  • DB|Underfill one-component epoxy sealant

DB|Underfill one-component epoxy sealant

DB840B

Application:Mobile phones, smart terminals, on-board vehicles Other handheld devices, etc. Filling of CSP/BGA

2023-03-08

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